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- wire bonding method 金属线接合法
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Pipe Bond Pin Brazing, the fastest, simplest, and most productive bonding method in the world. 自焊接式电缆连接铜钉是一个快速、简单和多用途的连接方式。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- Akira Sugiyama,Yasunaga Nara.Improved direct bonding method of Nd:YVO4 and YVO4 laser crystals[J].Ceramics International 2005,31:1085. 李志刚;熊政军;黄维玲等.;高功率激光二极管端面抽运复合晶体激光器的研究[J]
- Objective:To evaluate the clinical value and safety of colo-anal anastomoses with sustaining bonding method in the treatment of lower rectal cancer. 目的:评价管扎式结肠肛管吻合术治疗低位直肠癌的安全性和临床效果。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- Suggests the prop-er bond method should be chosen upon con ditions of wa- terproofing works to increase seal reliability of the laps. 建议根据防水工程特点,选用不同的粘贴方法,提高卷材与卷材接合部位的密封可靠性。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- In order to study the applicability of Transient Liquid Phase(TLP) bonding method to Cobalt-based superalloy K640,the bonding test adopting amorphous interlayer was carried out. 为考察瞬时液相(TLP)连接方法对钴基高温合金K640合金的适用性,采用非晶态中间层进行连接试验,观察接头区显微组织,测试接头的力学性能并进行断口分析。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- The specimens of nonwoven fabrics which were composed of different ratios of bicomponent (ES) fibre and waste silk fibre were manufactured by heat melt bonding method. 非织造布由不同配比的双组分(ES)纤维和蚕丝下脚料经混和,开松,梳理成网,并加热,熔融粘合而成。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- A novel Si/Ti/Au/Au/Ti/Si bonding method based on Au/ Si eutectic bonding was presented for forming a gas chamber. The detector was fabricated and responded basically using this bonding method. 运用Si/Ti/Au/Au/Ti/Si实现对探测器的金/硅共晶键合封装,形成气室,制备出探测器样品并初步得到响应。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- Objective To evaluate the clinical value and safety of colo-anal anastomoses with internal sphincter preservation by using sustaining bonding method in the treatment of lower rectal cancer. 目的评价保留内括约肌管扎式结肠肛管吻合术治疗低位直肠癌的安全性和临床效果。
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding. 目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
