挠性印刷电路基板用三层复合聚酰亚胺胶粘膜的制备及性能研究

挠性印刷电路基板用三层复合聚酰亚胺胶粘膜的制备及性能研究的英文翻译

基本释义

• Research on the preparation and properties of a three-layer polyimide film adhesive for flexible printed circuit board