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- These parts are surface mount inductors. 表面贴装电感器。
- These ceramic components make ideal surface mount devices (SMDs) and are eminently suitable for telecommunications, automotive and entertainment electronics applications. 这些陶瓷元件可制作理想的表面安装元件(SMDs)，并且非常适合于通信、自动推进和娱乐电子的应用。
- No Chinese investment corporation produces surface mount fuses. 表面贴装没有中资企业生产。
- Locate and unsolder surface mount resistor "A" (see picture below) be carefull! 找到并去除贴片电阻“”(看下图)要小心!
- The common electroless processes for plating different metals and alloys on ceramic surface and their pretreatment are presented. 本文论述了常用的陶瓷表面镀覆不同金属、合金的化学镀及其前处理工艺。
- Multilayer ceramic capacitors (MLCC) is one of the main products of the new surface mounted components (SMC). 摘要片式多层陶瓷电容器是新型片式元器件门类的主要品种之一。
- Many functional coatings can be obtained by electroless plating on ceramic surface to address the needs of different fields. 采用化学镀方法在陶瓷表面可获得多种功能性镀层，以满足各方面需要。
- Surface mounting and side entry type. 表面安装,侧面进线形式。
- Surface mounting and top entry type. 表面安装,正面进线形式。
- In order to obtain high stability &reliability chip NTC thermistor, coating glass to the NTC ceramic surface is one of the effective methods. 摘要为了得到更稳定、可靠的片式NTC热敏电阻器，在芯片表面涂覆一层玻璃釉是有效的途径之一。
- Package type EW (0.40 mm maximum height) offers a leadless surface mount solution. EW类型封装(最高为0.;40 mm)提供无铅表面安装解决方案。
- In order to obtain high stability & reliability chip NTC thermistor, coating glass to the NTC ceramic surface is one of the effective methods. 为了得到更稳定、可靠的片式NTC热敏电阻器,在芯片表面涂覆一层玻璃釉是有效的途径之一。
- Low solids flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. 用于表面安装组件的低固态物焊剂,有助于减少表面安装焊盘底侧的遗漏现象。
- The ceramic surface has the capacity of high hardness, wear resistance, corrosion resistance and oxidization resistance at high temperature. 该陶瓷层具有高硬度、高耐磨性、高耐蚀性和高抗高温氧化性能。
- MFJ QRP-Cub Transceivers use Surface mount Technology to achieve big performance in a pocket-sized package. MFJ QRP -幼童收发器使用表面贴装技术，以实现大的性能在口袋大小的包。
- The article introduces SPC method and the application of SPC in surface mount technology. 本文介绍了SPC法及其在表面贴装工艺中的应用。
- In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced. 为提高陶瓷金属化层的焊接性能,提出了一种陶瓷二次金属化镀镍工艺。
- The A132X family is provided in a 3-pin single in-line package (UA) and a 3-pin surface mount package (LH). A132X 系列以两种封装类型提供：3 引脚单列直插式封装 (UA) 和 3 引脚表面安装封装 (LH)。
- The material,ceramic surface can provide the greatest variety of patterns and styles to meet the tastes of different customers. What's more,bond and dense. 陶瓷面的材质能最大地丰富各种样式图案，满足不同客户要求生产，并且它是采用混凝土密实粘结上整个砖体的，而不是采用粘结剂。
- In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition. 表面贴装，钢网是锡膏正确重复印刷的要害。
