packing layer

• 填充层

packing layer的用法和样例：

例句

1. It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling.
   它能形成一致和无缺陷的底部填充层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。