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- No-flow underfill materials that cure during the solder reflow process is a relatively new technology. 在精细金属线条的连铸过程中,影响铸件品质的因素很多,所以有必要对不同的操作条件作影响评估。
- An automated optical inspection (AOI) machine can be put anywhere on the line to catch defects, and systems that continuously monitor the thermal profile in solder reflow ovens are becoming popular. 自动光学检测(AOI)机可安装在生产线的任意位置,以便捕捉缺陷,而能够连续监控再流焊炉的热曲线的设备也越来越流行。
- Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. 一旦被确认,SMD可被适当的包装、贮存和处理已避免在组装过程中的回流和/或返修中的热和机械损伤。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- Peak soldering reflow temperature also impacts cleaning performance. 再流焊的峰值温度也会对清洗性能造成影响。
- Suit for reflow and wave flow solder. 适应再流焊与波峰焊。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- Compatible with infrared and vapor phase reflow solder process. 适用于回流焊接工艺。
- Keywords soldering reflow;wave-soldering;manual soldering; 关键词回流焊;波峰焊;手工焊接;
- At the same time,experiments on PBGA solder ball laser reflow were carried out. 同时,本文还对PBGA钎料球激光重熔进行了试验研究。
- vapor phase solder reflow 汽相焊料回流
- Do not inhale the vapor during reflow. 不要吸入回流焊时喷出的蒸气。
- Adapted to the reflow soldering. 适应于回流焊接。
- Suitable reflow and wave soldering. 适合于回流焊和波峰焊
- Clear how to measuring reflow and wave profile. 清楚怎样测量回流焊和波峰焊温度曲线。
- SMOBC: Solder mask over bare copper. 一种阻焊层覆盖裸铜的工艺。
- Type of high density solder mask. 一种高密度焊料掩膜。
- Is there a standard lead-free solder alloy? 是否存在一种标准无铅焊料合金?
- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。