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The book also considers forming technologies for various composite material forms including thermoset and thermoplastic prepreg, molding compounds, and composite/metal laminates. 该书还认为成形技术，为各种复合材料的形式，包括热固性和热塑性预浸料，成型化合物，并复合/金属层板。
Bulk Molding Compound is specifically formulated for injection molding of automotive headlamp reflector applications. 玻璃纤维增强团状模塑料，是为汽车车灯设计的特殊配方。
Bulk Molding Compound with medium strength material with excellent moldability and moderate strength.Used in multi-purpose applications. 玻璃纤维增强团状模塑料，中等强度和优异电性能，低成本，良好的成型性。广泛应用于各种领域。
EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. EPBGA构装体由七个部分所组成，分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。
Compared with SMC, LPMC is an excellent kind of the sheet molding compound in respect of moulding pressure and equipment etc. 同片状模塑料比较表明,低压模塑料在成型压力、设备等方面具有明显的优势,不失为优秀的片状模塑料品种。
glass reinforced thermoplastic molding 玻璃(纤维)增强的热塑模制品
Bulk Molding Compound with high strength material with excellent moldability and moderate strength.Used in multi-purpose applications. 玻璃纤维增强团状模塑料，高等强度和优异电性能，低成本，良好的成型性。广泛应用于各种领域。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures. 对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
Thermoset composites are available in Bulk Molding Compound (BMC) or Sheet Molding Compound (SMC), depending on the application. 根据不同的应用领域，我们提供团状模塑料 (BMC)或片状模塑料 (SMC)热固性复合材料。
In recent years compounding raw fiberglass directly into thermoplastic molded parts (LFT D) is growing rapidly in Europe and USA. 近年来 ,长纤维热塑性树脂在线复合直接模塑制作热塑性复合材料 (LFT D)在欧洲和美国发展很快。
a polymer of propylene used as a thermoplastic molding material. 一种丙烯的聚合体，用作热塑性铸型材料。
The product is a thermosetting molding compound, it is based on phenolic resin as a matrix and mixed with inorganic glass fiber, mineral filler and other additives. 本产品以酚醛树脂为基材,加入玻璃纤维和矿物填料及其它助剂所制成的热固性模塑料。
The product is a thermosetting molding compound, it is based on phenolic resin as a matrix and mixed with organic fiber and mineral filler and other additives. 本产品是以酚醛树脂为基材,加入有机纤维和矿物填料及其它助剂所制成的热固性模塑料。
This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文针对阵列锡球封装产品基板和胶饼间所产生的分层作研究。
This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process. 中文摘要本论文主要针对铜钉架在经过封装制程其本身与胶饼间所产生的脱层现象做研究。
The method of polypyrrole (PPy) films being synthesized on the surface of insulating epoxy molding compound (EMC) electronic packaging materials and the shielding effectiveness of PPy film were studied. 研究了将导电聚吡咯(PPy)薄膜制备在绝缘环氧模塑料(EMC)电子封装材料表面的方法,及导电PPy 薄膜的电磁屏蔽效能。
The article has detailed the applications and developments of composites used in automobile, such as Fiber-reinforced plastics (FRP) , plastics blends, sheet molding compound (SMC) and so on. 本文详细论述了纤维增强塑料、高聚物共混合金、片状模塑料等复合材料的应用及其发展。
Test Method for Spiral Flow of Low-Pressure Thermosetting Molding Compounds (08. 低压热固性模制化合物的螺线流的试验方法(08。
MgO was used to thicken the low pressure sheet molding compound and crystalline unsaturated polyester was grinded into powder to regulate the viscosity in cavity of hot mold in this process. 摘要采用氧化镁为增稠剂、结晶树脂以粉料形式加入而降低片材热模内粘度的工艺，改进了对低压片状模塑料的增稠方法。
The properties of dough molding compounds(DMC)/ACM composite were experimentally investigated. 试验研究团状模塑料(DMC)/丙烯酸酯橡胶(ACM)复合材料的性能。