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- 叠层3D封装技术stacked 3D packaging technology
- 叠层封装Multi-Stack package
- 层layer
- 采用新型多层基板的多芯片组件封装技术Packaging Technology for Multichip Module Using New Type Multilayer Substrate
- 叠层芯片封装stacked die package
- 连续叠层技术non stop lamination
- 敞开式、错叠层、大跨度预应力板柱体系停车楼建筑技术研究应用Architectural Techniques Study and Application of the Open-type and Large Span Storied Garage Building in Split Level with Lamination and Prestressed Slab Column Structure System
- 叠层芯片封装元件SCSP
- 叠层灰岩stromatolithic limestone
- 褶叠层pleat
- 磁叠层magnetic lamination
- 双叠层double stacks
- 堆叠层stack layer
- 上叠层superimposed layer
- 叠层拱lamella arch
- 叠层管stacked tube
- 叠层梁laminated beam
- 叠层煤laminated coal
- 叠层木laminwood
- 叠层学stromatology
