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- Development of Control System Used in Ultrasonic Al Wire Bonding Machine 超声波铝线自动邦定机控制系统的研制
- Al wire bonding 铝线邦定
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Electrochemical property and cathodic protection performance of Zn wire,Zn-Al alloy wire,Al wire and their spray coatings in seawater were studied by electrochemical method. 采用电化学方法,研究了喷涂用锌丝、锌铝合金丝和铝丝及其喷涂层在海水环境中的电化学性能和阴极保护性能;
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy(SEM) with Energy Dispersive X-Ray Spectrometer(EDX). 本文采用电子扫描电镜(SEM)及X射线能谱(EDX)分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding. 目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
- Process of Feeding Al Wire in Mold of Slab Concaster 板坯连铸机结晶器喂铝丝工艺
- The structure and property of deformed single crystal Al wire 变形单晶铝线材的组织和性能研究
- Al causes operated to bring about the war. 那场战争的起因有几个。
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
- The concert included works by Mozart et al. 音乐会上演奏莫扎特等人的作品。
- Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied. 摘要基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
