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- Simple Hot Embossing 简易热压法
- A method of fabricating microlens arrays by hot embossing was introduced. 摘要提出一种采用热压印技术制作微透镜阵列的方法。
- The mold with stiffness and hardness plays an important role in GTMA hot embossing process. 而模具的刚度与硬度在三角无间隙微阵列透镜复制量产中，演重要的角色。
- The results show that the directional diffractive binary phase structure was achromatic and apt for hot embossing and offers a new method for AVOD. 实验结果表明;定向衍射二元光学位相结构具有消色散特征;且适合于热压复制工艺;为制造消色散光变图像提供了一种新方法.
- Aiming at the lost accuracy happened in HEL(hot embossing lithography) because of thermal distortion ,room-temperature imprint lithography is proposed. 针对热压印光刻工艺中因热变形而导致精度丧失的问题,提出了冷压印光刻。
- For conventional hot embossing, the substrate and the stamp are brought into contact and are compressed directly by the hot platen. 摘要:传统微奈米压印方法藉由压板机构来对基材进行加热及加压成形，容易导致压力施加不均匀、压印面积受限制以及微结构复制精度不良等问题；
- Hot embossing technology is used to manufacture high precision, high quality, and high aspect ratio of polymer micro structures. 热压成形技术可用以制造高精度、高品质、高深宽比之塑胶微结构。
- Heckele, M.,etal., “Hot embossing - The Molding Technique for Plastic Microstructures,” Microsystem Technologies, Vol4, pp.122 (1998). 施垂延，“微射出成形技术于微机电系统之应用与研究”，云林科技大学机械工程研究所硕士论文，1998年。
- First, a series of hot embossing experiments were conducted to transcript the micro U-groove features in a stamper onto large thin thermoplastic films with traditional hot press. 首先使用传统热压机进行薄膜热压实验探讨。研究发现薄膜的表面微结构成型，其成型技术远比板件困难；
- Using hot embossing method to fabricate the microchannel of PMMA plastic microfluidic chips,the process perimeters,i.e.temperature,pressure and time,affect the quality directly. 采用热压成形的方法制作塑料(PMMA)微流控芯片的微通道,其温度、压力和时间等工艺参数直接影响制作质量,而最佳的工艺参数取决于聚合物材料的流变特性。
- In the fabrication process, the electroplate technology is applied to fabricate mold, and hot embossing technology is provided to produced the structure of micropump. 利用压电片来驱动薄膜作为流体驱动源。在制作过程中利用电镀铜方式将母模制作出来，使用热压成形方式制作微型帮浦结构，最后使用热压接合方式完成封装。
- According to the experiment, combining with the characteristics of PLGA, the open-die hot embossing could not solve the problems of polymer’s inadequate filling and demolding. 根据实验过程中呈现的一些现象，结合可降解材料PLGA的特点，认为开放式热压成型不能很好解决材料充模不足和制品脱模困难等问题。
- A thermoelectric cooler was used as the main component of temperature controlling in hot embossing device to acquire high precision temperature control. 采用热电致冷器作为温度控制的主控元件构建了热压成型系统。
- J. H. Chang and S. Y. Yang, “Development of fluid-based heating and pressing systems for micro hot embossing,” Microsystem Technologies, Vol. 11, No. 6, pp. 396-403, 2005. 罗金德，超音波加热压印微结构的研究，台湾大学硕士论文，民国九十一年。
- A simple test will show if this is real gold. 简单的试验就能证明这是否是真金。
- Hot embossing is one of the forming technique used for the manufacturing of lens and the optical glass components.This technique produces high quality glasses products with very lowcost. 而微热压制程是发展微机电系统时制造高精度高品质微结构的重要成形技术之一，透过此成形之技术，可大量翻造出品质均一，且具高精度的产品目前已广泛应用于镜片等之生产。
- L.J. Heydrmn, H. Schift, C. David, J. Gobercht, and T. Schweizer, Flow behavior of thin polymer films used for hot embossing lithography, Microelectron. eng. vol.54, 229-245, 2000. 陈仁浩和王培良，塑胶微热压成形之研究，国立交通大学机械工程研究所硕士论文，民国八十七年。
- J.Mizuno, T.Harada and T.Glinsner,“Fabrications of micro-channel device by hot emboss and direct bonding of PMMA”, Proceedings of Nano and Smart Systems International Conference, pp.24-27, 2004. 陈建人;微机电系统技术与应用;行政院国家科学委员会精密仪器发展中心出版;民国92年7月.
- Small savoury biscuits provide a simple appetizer. 可口的小饼乾就是简单的开胃品。
- A slide-rule is a simple analogue computer. 计算尺是简单的模拟计算机。
