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- Sn0.7Cu钎料Sn0.7Cu solder
- Sn-O.3Ag-0.7Cu-xBi钎料Sn-0.3Ag-0.7Cu-xBi solder
- Sn-0.3Ag-0.7Cu-xNi钎料Sn-0.3Ag-0.7Cu-xNi solder
- Sn-2.5Ag-0.7Cu（0.1RE）钎料Sn-2.5Ag-0.7Cu(0.1 RE) solder alloy
- 钎料brazing filler metal
- 利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 理查德钎料Richard's solder
- 铝钎料Almit
- 钎料丝solder wire
- 铅钎料lead solder
- 软钎料low melting solder
- 钎料层filler metal layer
- 3P1钎料3P1 brazing alloy
- 镍基钎料Nickel base brazing filler metals
- 锡钎料tin solder
- 钴钎料cobalt braze
- 锌钎料spelter solder; brazing brass
- 银钎料silver-brazing alloy
- 硬钎料hard solder
- 用铝基钎料钎焊SiC陶瓷及其在SiC陶瓷表面浸润性的研究Study on Brazing of SiC Ceramics with Aluminum base Filler Metals and Their Wettability on the Surface of SiC Substrates
