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- The A132X family is provided in a 3-pin single in-line package (UA) and a 3-pin surface mount package (LH). A132X 系列以两种封装类型提供:3 引脚单列直插式封装 (UA) 和 3 引脚表面安装封装 (LH)。
- This new device is intended to also be offered in a plastic 8-pin SOIC surface mount package starting in approximately September 2007. 此款新器件自2007年9月左右起还将提供8引脚塑胶SOIC表面安装封装。
- The A3423 is available in a 4-pin SIP and a plastic 8-pin SOIC surface mount package (the SOIC version is currently in development). A3423采用4引脚SIP及塑胶8引脚SOIC表面安装封装(SOIC版本目前正在开发中)。
- Space Saving Skinny DIP and Surface Mount Packages 节省空间的Skinny DIP与SMP封装
- These parts are surface mount inductors. 表面贴装电感器。
- Package type EW (0.40 mm maximum height) offers a leadless surface mount solution. EW类型封装(最高为0.;40 mm)提供无铅表面安装解决方案。
- MFJ QRP-Cub Transceivers use Surface mount Technology to achieve big performance in a pocket-sized package. MFJ QRP -幼童收发器使用表面贴装技术,以实现大的性能在口袋大小的包。
- The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering. 加速度计的敏感元及测量专用芯片 (ASIC) 集成在 DIL 塑料封装内,其引脚可用于表面安装和回流焊接。
- It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation. 该器件采用供表面安装的无铅(引脚框是100%25雾锡电镀)6引脚MLP微型引脚框封装,并带有外露散热板以增强散热功能。
- No Chinese investment corporation produces surface mount fuses. 表面贴装没有中资企业生产。
- surface mountable package 表面可安装组件
- Locate and unsolder surface mount resistor "A" (see picture below) be carefull! 找到并去除贴片电阻“”(看下图)要小心!
- The QFN package(Quad Flat No-lead Package),a new and developing technology for chip package,is a small footprint,low profile,surface mount,plastic encapsulated package with leads on the bottom. QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。
- Surface mounting and side entry type. 表面安装,侧面进线形式。
- Surface mounting and top entry type. 表面安装,正面进线形式。
- The IM-600 features a DIN mountable package for easy panel mounting. IM-600的突出特点是提供一个DIN可安装程序包方便配电盘装配。
- Low solids flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. 用于表面安装组件的低固态物焊剂,有助于减少表面安装焊盘底侧的遗漏现象。
- The article introduces SPC method and the application of SPC in surface mount technology. 本文介绍了SPC法及其在表面贴装工艺中的应用。
- In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition. 表面贴装,钢网是锡膏正确重复印刷的要害。
- DIP: Dual in-line package with two rows of leads from the base in standard spacing between the leads and row. DIP is a through-hole mounting package. 双列直插式封装技术:指采用双列直插形式封装的集成电路芯片,列和引脚之间是标准间距。