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- 3 -D多芯片组件 (MCM)是未来微电子封装的发展趋势。3-D Multichip Module (MCM) is the developing trend of microelectronic packaging in the future.
- 3-D3-D
- 3-D电视3-D TV
- 3-D封装3-D packaging
- 3-D图形3-D plot
- 维生素D^3colecalciferol
- 3-d]嘧啶3-d]pyrimidine
- 3-D体数据3 - D volumetric data
- 3-D多孔钛3-D Porous Ti(titanium)
- 3-D展开法3-D expansion
- 3-D多脚状3-D multipod
- D-3羟丁酸D-3 Hydroxybutyric acid
- D-3维生素D3D2E7<维生素类药>
- D-3-羟丁酸D-3-Hydroxybutyrate
- 3-D人脸模型3-D face model
- 3-D中值滤波3-D median filter
- 3-D表面重建3-D surface reconstruction
- 1-β-D-ribofuranosyl-1H-1,2,4-triazole-3-carboxamide1-β-D呋喃核糖基-1H-1,2, 4-三唑-3-氨甲酰
- 维生素D^3微粒vitamin D^3 beadlet
- 3-D传感器组网3-D sensor network
