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- IC封装IC package
- 超薄型IC封装技术packaging for ultra-thin ICs
- IC封装的扩晶装置结构设计Structural Design of Wafer Expansion Device for IC Encapsulation
- HDI和IC封装用高性能覆铜板的开发The Development of High Quality CCL for HDI and IC Package
- IC封装设备划片机的研制Development of Wafer Incision Machine for IC Encapsulation
- IC封装热压模机合模机构设计与有限元分析Design and Finite Element Analysis for Clamping Unit of Auto Molding in IC Packaging
- 本产品是为IC封装自动贴片机及其贴片工艺而设计。This product design for IC assembly die bonding process on die bonder machine.
- IC卡IC-card
- TCP封装TCPencapsulation
- TO封装TO packaging
- IC门IC
- 铝封装aluminum encapsulation
- IC法IC method
- 封装变化Find what varies and encapsulate it
- UDP封装UDP encapsulation
- 模拟ICanalog IC
- 控制ICcontrol IC
- 封装胶encapsulation
- 3D封装3D package
- IC设计IC design
