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- COB封装COB assembly
- COB封装中热-机械耦合效应的研究Study of the Thermomechanical Coupling Effect in COB Packaging Structures
- COB封装中芯片在基板不同位置的残余应力Residual stress of different substrate site on in COB packages
- TCP封装TCPencapsulation
- TO封装TO packaging
- 铝封装aluminum encapsulation
- 封装变化Find what varies and encapsulate it
- UDP封装UDP encapsulation
- IC封装IC package
- 封装胶encapsulation
- 3D封装3D package
- CSP封装CSP package
- LED封装LED packaging
- 封装辊sealing roller
- 薄膜封装TCP: Tape Carrier package
- BGA封装BGA packaged
- 被封装到Call is encapsulated within the
- QFN封装QFN packages
- SMT封装SMT package
- SOT封装SOT-package