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- SOT封装SOT-package
- SOT型半导体元器件自动编带机的编带装置设计Development on the Taping Unit for SOT Semiconductor Component Taping Machine
- SOT型半导体自动编带封装机编带驱动部分的研制The Driver System of a Automatic SOT Diode Tape Machine
- 这两种器件均以两种封装类型提供:LH,供表面安装应用使用的SOT-23W微型低厚度封装;以及UA,供过孔安装使用的三引脚超小型单列直插式封装(SIP)。Both devices are offered in two package styles: LH, a SOT-23W miniature low-profile package for surface-mount applications, and UA, a three-lead ultramini Single Inline Package (SIP) for through-hole mounting.
- TCP封装TCPencapsulation
- TO封装TO packaging
- 铝封装aluminum encapsulation
- 封装变化Find what varies and encapsulate it
- UDP封装UDP encapsulation
- IC封装IC package
- 封装胶encapsulation
- 3D封装3D package
- CSP封装CSP package
- LED封装LED packaging
- 封装辊sealing roller
- 薄膜封装TCP: Tape Carrier package
- BGA封装BGA packaged
- COB封装COB assembly
- 被封装到Call is encapsulated within the
- QFN封装QFN packages
